100uPet ACF flex ALPIDE
In this insightful content, delve into the nuances of flex PCB manufacturing processes involving differential couples, padstack design, solder mask application, and more. Explore the challenges and considerations for achieving precise pad exposure, solder-to-pad gap measurements, and optimal biadhesive properties. Discover the significance of total thickness expectations, solder mask configurations, and testing structures for ensuring reliable flex circuit performance.
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Presentation Transcript
100uPet ACF flex ALPIDE manufacturing
Differential couples and padstack Chip pitch: 90um. Lines pitch flex 85um. Kapton or solder mask 10um Copper TOP 40um Kap Stackup FLEX VIAS 10um Copper LAYER3 40um 10um Copper BOTTOM SolderMasks ??um SolderMask SolderMask B:15um PAD 15um ENIPIG A:10um 100um 150um x 150um pad PAD 10um ENIPIG CHIP pad exposure of 10 m minimum for PAD ENIPIG
200 m of total thickness expected Solder mask on the top/bottom layer. Easier to produce with small opening. Not good for static flex. To verify Biadhesive datasheet with respect to temperature Minimum exposure of pad achieve on head 70 m for wirebonds. Add test structure to understand if we can use our standard pixel of 90 m pitch (60 m+30 m) Minimum solder to pad gap 50 m Differential couples 30 m/60 m.
