Explore the latest advancements in wafer production processes, including automated dicing, laser marking systems, and optimized recipes for increased efficiency. Learn how these innovations are revolutionizing the semiconductor manufacturing industry.
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R&D on dicing Serial production requiresa series of technical automation Upgrade of software of dicing machine Developeda pythoncode to automatize preparation of dicing programs
Laser marking system First wafer produced through100% automatic mode Thisallowsto increase the production rate and yield
Diced surfaces Diced Dicedsurfaces surfacesare wafer s wafer ssurface surface are now nowmuch muchmore more perpedicular perpedicularto to
Laser marking system Just received10 wafers coated with silicon nitride+siliconoxide(delay from the supplier of about1 month asusual ). Wafers diameter is 3 Optimizing dicingrecipe to operate under automation mode Studyinghowto increasecleaninglevelafter dicingoperations.
