Innovative Substrate Ideas for Timepix 4
Explore the latest advancements in substrate design for Timepix 4, including wet-etched glass from Micronit. Dive into cost estimates, substrate variants, and thermal simulation findings, paving the way for improved connectivity and production efficiency. Discover how ceramic 3D printing is revolutionizing the creation of intricate channels. Stay ahead in the world of cutting-edge technology with these exciting developments!
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Presentation Transcript
Timepix 4 Substrate ideas 3 JUN 2025 Yutaro Takahashi 1
Wet-etched glass Micronit Received cost estimate for 3, 10 and 10 wafers Concept Wafer (status last meeting) # of wafers # of substrates 3 10 100 20 200 30 Costs WP1 WP2 Proposal Nikhef NRE activities Etching 4840 14860 4840 29340 4840 45780 Total without WP2.1 19700 34180 50620 Cost per substrate without WP2.1 656,6667 341,8 253,1 Next steps Finalize design Determine order quantity Order Suggestion Micronit (Better use of space, cheaper production) 2
Finalizing design Substrate variants 3 shapes Top connect: 40x36 [mm] Single side connect: 51x25 [mm] Double side connect: 60x25 [mm] If chipboard gets wider, it starts making less sense to connect on the side Redesign substrate and reorganize wafer?? Quantities Maximize number of substrates, or maximize number of test samples? 3
Some other progress Thermal simulation Poor thermal conductivity of glass DT over the substrate is ~4,8 C Acceptable Ceramic 3d printing Printed channels of 0,2 x 0.2 mm 4
