March Engineering Session Updates: Design, Tasks, and Mockup Considerations

Introduction Introduction mechanical Mock- -up Thermo Thermo- -mechanical Mock up March 21st, Didier Construction & engineering session

Design Status and Consideration Item Design status Production schedule 6 wafers with 1 m Al delivered in January Processing / cutting at CMI and Campus Biotech Expected ~ Early March (more can be processed later) Gel-pak ordered Expected ~early in March Flex delivery expected ~ End of March Assembly of SMD few to be made in April Production from atelier de la section expected ~ end of February Expected within the next 3 - 4 weeks. Franck to confirm Likely in 2 weeks? Sensor (active for heating and temperature reading ) Completed since December Hybrid flex with stack-up close to final design Completed since January Assembly tools for module and flex Completed since January Base plate, insulation plates and load system To be worked out and discussed the next steps Complete or almost Sebastien? Module test board to power and readout RTDs TMI and MAB to drive power and DCS signal and integrating an ADC multiplexer To be worked out and discussed the design strategy/requirements Schedule to be discussed and agreed

Tasks in the coming month With the probe station: Test of RTDs on 1-2 wafer(s) and get calibration versus temperature for some identified sensors Get the resistance measurement/dispersion for some sensors need to check that the dispersion does not exceed 10% If it exceed 10% one need to define a strategy to match resistance value per module and measure systematically all dummy sensors make gel-pak category With the assembly tools: Check the alignment of the sensors and make the metrology of the pads and sensors on the jigs after being aligned with the pins If imperfections are found, try to mitigate the misalignment by making unique pin for the correction of machining errors Check again with the metrology machine with the pins adapted in size Check the alignment of the flex and make the metrology survey of the contact pads once sucked on the jig. If imperfections are found, try to mitigate the misalignment by making unique pin for the correction of machining errors Assembly trials with stainless steel dummy sensors and translucent Kapton dummy flex Once the tools are considered ready for assembly try the 1stassembly with sensor and flex o Check the continuity while bonding o Test the temperature ramp-up and ramp-down with heater and cooling system as well as will the 80 kg compression strain With the 1stmodule: Continuity, current test, X-rax inspection, thermal cyling

Construction of the Mockup - Considerations Goal reminder: Demonstration that module assembly method and the interconnection are reliable and under control Demonstration that the tower construction works ok in term of mechanics and service integration Demonstration that the thermal and mechanical behavior works ok in comparison with FEA models Optimization of the assembly process is expected: Max temperature, compression force and cooling sequence Alignment / interconnection success to be checked extensively using: o X-ray inspection method o Continuity test of the bumps o Thermal IR inspection while injecting some current (up to 100 mA) o Thermal cycling + check of current stress tests Activity Location People Module assembly Gray room laminar flow? Coralie, Sylvain?, Franck, Didier, Mateus Module tests and qualification Gray room, Labo photo Mateus, Jihad, Didier, ??? Tower assembly Gray room Coralie, Franck and all Mock-up set-up and testing Space to be identified Mateus, Jihad, Didier, Franck, Sebastien Quite some effort is expected to set-up the readout system for the module temperature and of external readout (environmental and cooling)