Mathematics Learning Essentials
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Task List and Follow Task List and Follow- -up up September 12th , 2024 Construction & engineering session
Work Packages 1/3 Thermal mock-up WPs WP 1 WP 1.1 - Module 1. Sensor 1. 2. 3. 2. Flex (Terry, Sebastien) 3. Break-out board (BOB) (Sebastien) 4. Assembly jigs (Franck) 5. Assembly procedure (Franck, Didier Mateus) 6. Absorber plate 1. Procurement (Mateus) 2. Assembly procedure (Franck, Mateus, Didier) 7. Module QC (Mateus, Didier) WP 1.2 - Off-detector 1. MAB and TMI (Sebastien) 2. Power supply (Sebastien, Didier, Mateus) 3. Monitoring (Sebastien, Mateus, Jihad, Didier) 4. QC of the chain down to MAB and module (Sebastien, ) WP 1.3 - Thermal mock-up installation 1. Test bench installation (all) 2. Mechanics with cooling interface and system (Franck, Didier, Mateus) 3. Commissioning (Mateus, Jihad, Didier) 4. Data taking (Mateus, Jihad, Didier) 5. Comparison to (Mateus, Jihad, Franck, Didier) Sensor fab (Mateus & Jihad) Sensor dicing to be outsourced Bump deposition outsourced with Hybrid SA
Work Packages 2/3 Monolithic chip WPs WP 2 WP 2.1 Design and Documentation (Roberto, Thanu, Lorenzo, Carlo ) WP 2.2 Production 1. Processing (Lorenzo) 2. Thinning and backplane metallization (Lorenzo) 3. Dicing (Lorenzo) WP 2.3 Testing 1. Probe card and adapters (Terry, Sebastien, Didier) 2. Mechanics to hold the chips (Franck, Laurent, Didier) 3. Chip QC and yield (Mateus, Jihad, ) 4. Yield WP 2.4 Bump deposition (Didier, Mateus) 1. QC after bump deposition (Didier, Mateus) 2. Yield
Work Packages 3/3 PET construction WP 3 WP 3.1 - Module 1. 2. 3. 4. Chip related to WP-B Flex (Terry, Sebastien) Break-out board (BOB) (Sebastien) Absorber plate 1. Procurement (Mateus) 2. Assembly procedure (Franck, Mateus, Didier) Assembly jigs (Franck) Module test set-up Readout board??? - Should we use the MAB? - Should we make an adapter board to GPIO? Module QC (Mateus, Jihad, Didier) - Test procedure to be defined WP 3.2 Off-detector electronics 1. Readout architecture(Sebastien, Yannick) 2. MAB and TMI (Sebastien, Terry) 3. Powering chain (Sebastien, Mateis, Didier) 4. Services (Sebastien, Mateus, Didier) 5. Detector safety and interlock (Sebastien, Mateus, Didier) WP 3.3 Scanner integration 1. Cooling walls and interfaces including pipe fitting 2. Integration and mechanics 3. Services layout/integration with mechanics and stress relief 4. Mouse housing integration and services 5. Integration of electronics (cards and crate) and of cooling system 5. 6. 7.
Critical Topics and Watch List Chip yield: - Urgent to be ready for chip testing and estimate a 1styield If below 50% and close to 10% Redefine the project construction target If above 50% One can assume that target can still be sustainable Yield number is essential to know asap Missing items burning topics: chips, adapter, firmware, software Top priority Module assembly: - Essential to assess that the interconnection technique is validated with assembly jigs Procedure to be qualified Tg still need some investigation Alignment and reproducibility of the interconnection must be close to 100% Compression force with 4 chips is one of the parameters we could play with Yield number is essential to know after assembly Missing items Flex?, more chips, camera, mechanics? ok with mock-up modules Urgent Flex production (electrical): - Design and production yield to monitor Flex qualification only when 1st electrical module is readout and performances assessed Requires to have a final module flex asap Yield and qualification of the flex is essential Missing items Flex design and production, adapter board, firmware, grade-A chips Urgent
