Metallic Bonding and Semiconductor Fabrication
Explore the principles of metallic bonding, semiconductor materials, and chip fabrication processes through band theory, photoelectron spectroscopy, and doping techniques. Learn about the conduction in solids, silicon semiconductors, and circuit components such as diodes and transistors. Discover the steps involved in chip fabrication, including the purification of silicon and doping processes to create semiconductor devices. Gain insights into the application of photolithography in semiconductor manufacturing.
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Presentation Transcript
Band Theory: Metallic Bonding Photoelectron Spectroscopy
Band Theory: Metallic Bonding Photoelectron Spectroscopy
Band Structure for Periods 4-6, Group 1A 2B http://employees.oneonta.edu/viningwj/sims/metallic_bonding_band_theory_s.html
Chip Fabrication 1. Make really, really pure Si 2. Add impurities in a controlled way (doping) SiO2(s) + 4 HCl SiCl4 (l) + H2O(l) SiCl4 purified by distillation. SiCl4 + 2 Zn Si + ZnCl2 Si now 99.9% pure. Zone refining used to purify to 99.99999% pure.
Circuit Components Diodes Transistors
Doping 1. Apply coating 2. Illuminate through mask 3. Dissolve illuminated areas 4. Add gas phase dopant 5. Repeat
Photolithography http://www.cnf.cornell.edu/cnf_process_photo_resists.html
