Powering and Cooling Solutions for Stave Modules in GOAT-1 Proposal
The GOAT-1 proposal presented at the EUDET Annual Meeting in Amsterdam focused on powering and cooling methods for the Stave modules. It included details on the parallel powering scheme, cooling of the Stave module, and heat transport simulations. Evaluations by Bart Verlaat of NIKHEF in Amsterdam provided insights into power per Stave, CO2 cooling, and aluminum blocks. The proposal also discussed the use of available aluminum block cross-sections, power supply sources, and power losses. Overall, the research aimed to optimize the performance of the Stave modules in the ATLAS Pixel B-Layer Replacement Proposal.
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Powering of the Stave modules in the GOAT-1 proposal. Vladimir Gromov, Ruud Kluit, Harry van der Graaf. NIKHEF, Amsterdam. EUDET Annual Meeting, Amsterdam, the Netherlands. October 6, 2008.
Outline The GOAT-1 proposal : Gossip in ATlas. Cooling of the Stave module. Parallel powering scheme. Summary. EUDET-08 6/10/2008 V.Gromov 2
GOAT-1: GOssip in ATlas The ATLAS Pixel B-Layer Replacement Proposal. Inner Layer: 7 double Goat strings Gossip detector unit (1.4cm x 1.4cm) ~1m 64 chips 60mm Beampipe P-string conductor CO2cooling channels G-string conductor EUDET-08 6/10/2008 V.Gromov 3
Cooling of the Stave module. Evaluations done by Bart Verlaat (NIKHEF, Amsterdam) Power_per _stave = 1.4cm 1.4cm 128chips 100mW/cm2= 26W CO2cooling tube - diameter 0.5mm - mass flux 858kg/m2 sec Aluminum block - total cross-section 8.6mm2 EUDET-08 6/10/2008 V.Gromov 4
Heat transport to the cooling tube. Simulations done by Bart Verlaat (NIKHEF, Amsterdam) Aluminum block - total cross-section 8.6mm2 +10.1mm2 Goat 1 stave Tmax=2 C CO2cooling tubes EUDET-08 6/10/2008 V.Gromov 5
Parallel powering scheme. Consider the use of the available ALU block cross-section (S=8.6mm2). R R R R R R R 1.192V 1.2V 1.2V 11A 11A 340mA Chip #127 170mA Chip #128 170mA Chip #126 170mA Chip #125 170mA Chip #66 170mA Chip #64 170mA Chip #63 170mA Chip #65 170mA Chip #1 170mA Chip #2 170mA Chip #3 170mA Chip #4 170mA Power Supply Source 1.2V Power Supply Source 1.2V R R R R R R R 0V 0V 8mV 1.4cm 8.6mm2 R= 26.5 10-9 m 1.4 10-2m / 8.6 10-6m2 = 4.3 10-5 . V = R 11A+ R (11A-0.34A) + R (11A-2 0.34A)+ + R 0.34A = 8mV Power losses 0.9% EUDET-08 6/10/2008 V.Gromov 6
Powering scheme with non-regular ALU block. R R2 R31 R1 R1 R2 1.185V R2 1.2V 1.2V 11A 11A 340mA Chip #127 170mA Chip #128 170mA Chip #125 170mA Chip #126 170mA Chip #65 170mA Chip #66 170mA Chip #64 170mA Chip #63 170mA Chip #1 170mA Chip #2 170mA Chip #3 170mA Chip #4 170mA Power Supply Source 1.2V Power Supply Source 1.2V R31 R R1 R R2 R1 R2 0V 0V 15mV V V V R= 4.3 10-5 V = R 11A 32 = 15mV Power losses 1.3% EUDET-08 6/10/2008 V.Gromov 7
Summary. The cooling system proposed for the GOAT-1 project requires an Aluminum stave for heat transportation to the CO2 tube. The Aluminum stave could also be used for the powering of the read-out electronics. The presented analysis demonstrates that with the available amount of conductive material (aluminum) the parallel powering scheme could be successfully used. EUDET-08 6/10/2008 V.Gromov 8
