THE DESIGN AGAINST RADIATION EFFECTS (DARE) DESIGN PLATFORM FOR TSMC 65NM PROCESS.

THE DESIGN AGAINST RADIATION EFFECTS (DARE) DESIGN  PLATFORM FOR TSMC 65NM PROCESS.
Slide Note
Embed
Share

The DARE65 Design Platform is a radiation-hardened, high-performance, and cost-effective platform designed for space applications using the TSMC 65nm CMOS process. It includes features such as AIP STD cells library, Memory IP, IO library, dual gate oxide process, multiple VT options, and deep Nwell option. The platform operates under specified voltage, temperature, and radiation levels and offers mitigation methods for radiation effects.

  • DARE65
  • Design Platform
  • TSMC 65nm
  • Radiation Effects
  • Space Applications

Uploaded on Feb 16, 2025 | 0 Views


Download Presentation

Please find below an Image/Link to download the presentation.

The content on the website is provided AS IS for your information and personal use only. It may not be sold, licensed, or shared on other websites without obtaining consent from the author.If you encounter any issues during the download, it is possible that the publisher has removed the file from their server.

You are allowed to download the files provided on this website for personal or commercial use, subject to the condition that they are used lawfully. All files are the property of their respective owners.

The content on the website is provided AS IS for your information and personal use only. It may not be sold, licensed, or shared on other websites without obtaining consent from the author.

E N D

Presentation Transcript


  1. THE DESIGN AGAINST RADIATION EFFECTS (DARE) DESIGN PLATFORM FOR TSMC 65NM PROCESS. M. KAKOULIN, S. REDANT, G. THYS, S. VERHAEGEN, G. FRANCISCATTO, B. CHEHAB, G. POLLISSARD, L. BERTI AMICSA, 2018 CONFIDENTIAL

  2. DARE65 DARE65: RAD HARD DESIGN PLATFORM High-performance, cost-effective RH space applications AIP STD cells lib, Memory IP & IO lib Sponsored by: ADK (Electrical, LVS, DRC, RAD checks, SETsim) PROCESS (TSMC 65 nm CMOS) 2 CONFIDENTIAL

  3. DARE65 THE DARE65 DESIGN PLATFORM: PROCESS Commercial TSMC 65 nm LP process Deep Nwell option RDL available for Flip-chip MOM or MIM capacitors Dual gate oxide process 1.2V (core)/2.5V(IO) Multiple VT (high VT, standard VT, low VT) 9 Cu metal layers + last metal layer in AL pad Regular MPW shuttle runs Cost effective for low volume MLM runs 3 CONFIDENTIAL

  4. DARE65 THE DARE65 DESIGN PLATFORM: OPERATING CONDITIONS & HARDNESS GOAL Parameter Min Typ Max Core voltage, V 1,08 1,2 1,32 IO voltage, V 2,25 2,5 2,75 Temperature, 0C -55 25 +125 TID, krad 100 300 SEL, MeV.cm2/mg 70 4 CONFIDENTIAL

  5. DARE65 THE DARE65 DESIGN PLATFORM: SEU, SET CAPABILITY GOAL Parameter Min Typ Max High, MeV.cm2/mg 60 Medium, MeV.cm2/mg 25 Basic (non hardened), MeV.cm2/mg 1 5 CONFIDENTIAL

  6. DARE65 THE DARE65 DESIGN PLATFORM: MITIGATION METHODS 65 nm process NMOS core transistor radiation results (RVt) [1] Threshold Drive current Leakage current 1 - Bonacini, P. Valerio, R. Avramidou, R. Ballabriga, F. Faccio, K. Kloukinas and A. Marchioro, 2012 JINST 7 P01015. Characterization of a commercial 65 nm CMOS technology for SLHC applications 6 CONFIDENTIAL

  7. DARE65 THE DARE65 DESIGN PLATFORM: MITIGATION METHODS No SEL is found at room temperature in all SRAM blocks at effective LET 60 MeVxcm2/mg [2]. The SEL occurs in 6T block only at effective LET 60 MeVxcm2/mg and at high operating temperature [2]. Another test results shows the SEL effect in 65 nm commercial STD cells at even lower LET at high operating temperature (appr. LET 20 MeVxcm2/mg ) SEU cross-section LET dependence for SRAM blocks in 65 nm [2]. 2 - Maxim S. Gorbunov, Member, IEEE, Pavel S. Dolotov, Student Member, IEEE, Andrey A. Antonov, Gennady I. Zebrev, Vladimir V. Emeliyanov, Member, IEEE, Anna B. Boruzdina, Andrey G. Petrov, and Anastasia V. Ulanova (2004, August). Design of 65 nm CMOS SRAM for Space Applications: A Comparative Study. 7 CONFIDENTIAL

  8. DARE65 THE DARE65 DESIGN PLATFORM: MITIGATION METHODS Factor - No ELT transistors - Limits of the minimum core and IO NMOS and PMOS transistors gate width - 2 limitations are set: for digital designs and for analogue designs (larger W). - Deep N-well - Guard rings prevent leakage between N regions due to TID - n+ and p+ guard rings connected to supply or ground voltages - double contact in source/drain areas of transistors - Device spacing to avoid doublehits - No Hot MOS (i.e. MOS where the bulk is not connected to GND or VDD). - Drive Strength Hardening especially to create SET hardened standard cells. - SET filters - DICE FF - Bit alignment in SRAM blocks to avoid MBU TID SEL SEU/SET 8 CONFIDENTIAL

  9. DARE65 THE DARE65 DESIGN PLATFORM: DARE65T_ADK DESIGN KIT IMEC ADK Schematic RH rules checks (script) Layout RH rules checks (Calibre) SET simulation environment (Striker & prober) Customer analogue IP design 9 CONFIDENTIAL

  10. DARE65 THE DARE65 DESIGN PLATFORM: DARE65T_CORE - STD CELL LIBRARY Type N 52 7 7 7 9 5 1 2 1 3 8 Non-SET hardened combinational cells SET hardened combinational cells - 25 MeV... SET hardened combinational cells - 40 MeV... SET hardened combinational cells - 60 MeV... Non-SET hardened sequential cells SEU hardened sequential cells 2) ANTENNA cells TIEH and TIEL Non-SEU hardened clock gating cells SEU hardened clock gating cells Filler cells multi-VT (HVt, SVt, LVt) support digital/analogue-on-top & design flow support 12 track library 0,2 um pitch SET & SEU hardened cells for clock & reset tree SET hardened combinational cells SEU hardened flipflops and latch (DICE) totally 102 cells raw gate density is 344 kGates/mm2 TSMC 9T SC library comparable performance 10 CONFIDENTIAL

  11. DARE65 THE DARE65 DESIGN PLATFORM: DARE65T_CORE - STD CELL LIBRARY DARE65T_CORE DICE and standard non-RH FF 11 CONFIDENTIAL

  12. DARE65 THE DARE65 DESIGN PLATFORM: DARE65T_IO IO CELL LIBRARY cold-spare feature programmable drive strength slew rate control programmable pull up/down uni / bidirectional 2 kV HBM supports 1,8/2,5V & 3,3 V supply voltage maximum supply voltage 3,63V breaker cells multi power domain support flip-chip support 12 CONFIDENTIAL

  13. DARE65 THE DARE65 DESIGN PLATFORM: DARE65T_IO SSTL IO CELL LIBRARY SSTL18 cells (RX_SE, RXTX_SE, RX_DIFF, RXTX_DIFF) 1.8V 5% supply voltage Defined in JESD8-15A, but visibly not updated and replaced by JESD79-2F (defines ODT, levels vs speed...), the DDR2 standard DDR2-800 support SSTL15 cells (RX_SE, RXTX_SE, RX_DIFF, RXTX_DIFF) 1.5V 5% supply voltage Definition embedded in standard of DDR3 (JESD79-3F) Impedance calibration support Configurable delay line DDR3-800 support 13 CONFIDENTIAL

  14. DARE65 THE DARE65 DESIGN PLATFORM: DARE65T_LVDS LVDS IO CELL LIBRARY DARE65T_LVDS transmitter and receiver IO cells based on 2,5 V overdrive 3,3 transistors 2,5 and 3,3 V voltage supply up to 400 Mbps (200 MHz) 14 CONFIDENTIAL

  15. DARE65 THE DARE65 DESIGN PLATFORM: DARE65T_SRAM MEMORY Custom cell, SEL free SPRAM compiler DPRAM instances DRAM custom cell: 1,9 x 2,75 um2 2 SRAM cells solutions: Conservative SRAM cell With intermittent guard ring, 1,5 times smaller The DARE65 SPRAM cell: 1,9 x 1,85 um2 15 CONFIDENTIAL

  16. DARE65 THE DARE65 DESIGN PLATFORM: DARE65T ANALOGUE IP Analog IP DARE65T_PLL Main features 200-1200 MHz output frequency 2,5-32 MHz reference frequency Supply voltage 1,2V. 1,2V and 2,5 supply voltages 0,6V output reference voltage Reference current output Accuracy (before trimming) 2,5 % 10 bit resolution Integrated temperature sensor 10 kHz sampling rate. Supply voltage 1,2V. TBD DARE65_IVREF DARE65_ADC DARE65_POR 16 CONFIDENTIAL

  17. DARE65 FURTHER WORK Test vehicle platform validation MS capability improvement SerDes: RapidIO, SpaceFiber DDR2/3 PHY High-speed ADC & DAC 3.Memory capability improvement OTP & MRAM memory 1. 2. 17 CONFIDENTIAL

  18. CONFIDENTIAL

More Related Content