University of California Santa Cruz ePIC BTOF Assembly Plans
Image objects and details regarding the pre-assembly activities, assembly plans at SCIPP, identification of funds and space needed, equipment required, development of assembly procedures and components, and the development of stavelet DAQ for QC at the University of California Santa Cruz.
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UCSC ePIC BTOF assembly plans Dr. Simone M. Mazza - University of California Santa Cruz 4/20/2025 1
Pre-assembly activities R&D Activities Sensor testing: IV/CV/laser Sensor irradiation Sensor redistribution and assembly on boards Boards design and production Support of the TB (DESY, JLAB, CERN) Dr. Simone M. Mazza - University of California Santa Cruz 4/20/2025 2
Assembly plan at SCIPP Task 1: Assembly stavelets (16cm long parts with sensors and ASIC) Volume: 144 staves, ~300 half staves made of ~8 stavelets Wirebonds per stavelet: ((128 + 128)x2 (sensors-> interposer ->chip) + ~20(chip))x4 ~2000 bonds Assuming 4 BTOF assembly sites: ~500 stavelets per site in 2 years, around 1 stavelet per day which is a ~low volume! Assembly procedure Receive bare sensors, QC on sensors (visual, IV) Receive bare chips, QC on chip (or already done) Fabricate interposer boards Glue and assemble sensors and chips, QC (metrology, mechanical) Wirebond, QC Dr. Simone M. Mazza - University of California Santa Cruz 4/20/2025 3
Assembly plan at SCIPP Task 1: Assembly stavelets (16cm long parts with sensors and ASIC) Identify funds and space needed Fraction of tech, >1 day per week Postdoc Space we have a laminar flow bench available and a bit of space in the clean room should open in a few years Equipment: glue robot, dry cabinets, a fraction of a wirebonder? We have some funds from past PED request that we ll use for some of this equipment need communication to buy equipment not in the original PED Dr. Simone M. Mazza - University of California Santa Cruz 4/20/2025 4
Assembly plan at SCIPP Task 2: Development of assembly procedure and components Development of jigs and supports for assembly, QC and shipping Define the choice of glue Identify the correct glue machine for the assembly Dr. Simone M. Mazza - University of California Santa Cruz 4/20/2025 5
Assembly plan at SCIPP Task 3: Development of stavelet DAQ for QC Once stavelet is assembled we need a way to do QC on chips and sensors Develop a board that clamps on or need to be connected via wirebonds to operate chips and sensors Develop a test station (source/X-ray gun) to scan all channels connected Need engineer time to develop board and DAQ Dr. Simone M. Mazza - University of California Santa Cruz 4/20/2025 6
Assembly plan at SCIPP Task 4: Assembly of full stave? Harder because of funding and space Would need significant support as we need extra equipment and construction The number of wirebonds is minimal, it s mostly gluing and positioning But we can develop jigs and supports for it Maybe done at Purdue? (where final stave sandwiching will happen) Dr. Simone M. Mazza - University of California Santa Cruz 4/20/2025 7
SCIPP road-to-assembly Demonstrator assembly Develop tooling Assembly X stavelets Full assembly ITk (ATLAS) assembly Dr. Simone M. Mazza - University of California Santa Cruz 4/20/2025 8
