
IEEE 802.11-24 TGbe May Interim Closing Report 2024
The May 2024 interim session for IEEE 802.11-24 TGbe focused on resolving comments from the initial SA ballot. Two joint sessions successfully addressed all received comments, leading to the cancellation of the last two sessions. The newly generated IEEE802.11 TGbe D6.0 is up for a 15-day recirculation SA ballot. Future goals include processing comments from the recirculation SA ballot related to PHY and JOINT MAC CID Distribution.
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May 2024 doc.: IEEE 802.11-24/0652r0 TGbe May Closing Report Date: 2024-05-16 Authors: Name Alfred Asterjadhi Qualcomm Inc. Affiliations Address Phone +1-858-658-5302 aasterja@qti.qualcomm.com email 5775 Morehouse Drive, San Diego, CA 92121, U.S.A. Submission Slide 1 Alfred Asterjadhi, Qualcomm Inc.
May 2024 doc.: IEEE 802.11-24/0652r0 TGbe (Extremely High Throughput) TGbe had scheduled 4 sessions during the May interim Two Joint sessions were sufficient to resolve all the received comments from initial SA ballot Hence, last 2 sessions scheduled on Thursday were cancelled Reconfirmed TGbe vice-chairs, secretary and editor The TGbe editor generated IEEE802.11 TGbe D6.0 Which is available in the members area Approved a 15-day recirculation SA ballot on P802.11be D6.0 Agenda is available in 11-24/0651r5 Motions List is available in 11-23/442r52 Goals for July 2024: Process and resolve comments from recirculation SA ballot ~5% PHY ~90% ~5% JOINT MAC CID Distribution (415) Submission Slide 2 Alfred Asterjadhi, Qualcomm Inc.
May 2024 doc.: IEEE 802.11-24/0652r0 Teleconference Plan To be announced with 10-day advanced notice - Submission Slide 3 Alfred Asterjadhi, Qualcomm Inc.
May 2024 doc.: IEEE 802.11-24/0652r0 TGbe Timeline And Status PAR approved First TG meeting D0.1 D1.0 WG Comment Collection D2.0 WG Letter Ballot D3.0 LB D4.0 LB D5.0 Recirculation LB Initial SA Ballot Final 802.11 WG approval 802 EC approval RevCom and SASB approval Mar 2019 May 2019 Sept 2020 May 2021 May 2022 Jan 2023 July 2023 Nov 2023 Jan 2024 Sept 2024 Sept 2024 Dec 2024 Slide 4 Submission Alfred Asterjadhi, Qualcomm Inc.